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Description
Features of GIGABYTE B850M Aorus Elite Wifi6E ICE DDR5 AMD Motherboard
X3D Turbo Mode
Unleash New Era Gaming Performance with One-Click Activation.
X3D Turbo Mode's unique optimization parameters allow even Ryzen™ 9000 X3D gaming Performance enhance & Ryzen™ 9000 non-X3D processors to achieve similar gaming performance levels as their Ryzen™ X3D counterparts. Experience smoother gameplay, higher frame rates, and reduced latency with GIGABYTE's BIOS innovation- X3D Turbo Mode.
One-Click Acceleration:
Enhance Gaming FPS Performance with a single clic
Auto CPU & DDR5 Memory Boost
With just a single click, unleash the full potential of CPU & DDR5 memory, instantly boosting your gaming and work efficiency.
One-Click Acceleration:
Enhance CPU & DDR5 speeds with a single click.
- Real time Analyze
- OC accuracy UP
- EZ to Pro
Fast AI Performance
Accelerate AI processing for greater performance
Up to
8%
AI Performance*
Accelerated AI decision-making
Boosted reinforcement learning
Streamlined language processing
Boost CPU & Memory Performance
Raise system speed and performance.
Up to
9%
CPU & Memory Performance Boost
Tailored-overclocking for your CPU and memory
Faster data transfer and application loading
Improved multitasking performance
Optimized overall system performance
Maximize performance in a snap
Enable users to easily become overclocking experts through a simple interface.
AI-Driven PCB Technology -Redefining PCB Design with Artificial Intelligence
AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups. It ensures peak performance and signal integrity across single and cross-layer throughout the design process.
AI-ViaFusion Technology
Optimized vias & pads for signal integrity
AI-Trace Technology
Smart routing for peak performance
AI-Layer Technology
Tailored stackups for enhanced functionality
Key Features:AI-Generated Design Recipes
AI-Driven Simulation
AI-Powered Signal Verification
Single and cross-layer signal optimization
AI-ViaFusion™ Technology - AI-Powered Excellence in Signal Integrity
Reduction in Signal Reflection Up to 28.2%
AI-ViaFusion, an AI-assisted via optimization technology, determines optimal via and pad sizes across PCB areas. This technology enhances cross-layer signal integrity and transmission efficiency, outperforming traditional design methods.
Best-in-class Signal Quality
Superior signal transmission efficiency
Dramatically reduced signal reflection
Elevated signal quality and reliability
Enhanced cross-layer PCB signal performance
AI-ViaFusion Technology - AI-Engineered Via Design Formula
AI-ViaFusion is a proprietary AI-generated hybrid via structure design. This PCB technology, validated through AI simulations and testing, aims to enhance high-speed signal transmission.
Optimized Via Design
Varied via sizes for optimized signal and power paths
Driven Pad Optimization
Custom pad sizes for performance and production balance
Precision Impedance Matching
Via & pad sizes selected for optimal signal impedance
Unlock AI-Powered Performance with AI-ViaFusion Technology
Minimized Insertion Loss
Optimized vias reduce signal loss
Enhanced Return Loss
Precision impedance matching reduces reflections
Optimized Eye Diagram
Wider eye opening improves signal integrity
AI-ViaFusion Technology - AI-Driven Revolution in PCB Design
Vias (Vertical Interconnect Access) are critical for multi-layer PCB connectivity. Via size significantly impacts signal integrity, affecting capacitance, reflections, and crosstalk.
AI-ViaFusion Technology optimizes PCB performance through:
Strategic Via Sizing
Optimized for varied signals across PCB
Enhanced Impedance Matching
Precise control via machine learning
Space Optimization
Maximized layout efficiency with signal integrity
AI-Trace Technology -Revolutionizing PCB Routing with AI
AI-Trace Technology transforms PCB design by leveraging AI to optimize trace routing, resulting in enhanced performance and signal integrity.
Fiber Weave Effect Mitigation
Optimized signal synchronization
Shielded Memory Routing
Optimized signal shielding and precision
Impedance-Optimized Topology
Refined traces with minimal resistance
Isolated Memory Routing
Optimized trace layout and layer separation
Daisy-Chained Routing
Innovative design eliminates signal bottlenecks
Mitigating Fiber Weave Effect with AI-Trace Technology
Fiber Weave Effect in high-speed PCBs stems from varying dielectric constants of epoxy resin and glass fibers, this causes varying signal propagation speeds, leading to signal integrity issues such as crosstalk and jitter. AI-Trace Technology implements innovative routing angles to mitigate this effect.
Benefits of Mitigation:
- Reduces signal distortion
- Improves transmission reliability
- Supports higher data rates
- Enhances overall system stability
AI-Layer Technology -Next-Generation Multi-Layer PCB Design
AI-Layer Technology creates innovative layer materials for multi-layer PCBs, delivering unparalleled performance.
Core Innovation:
AI-Optimized Layer Customized Design
- AI-optimized layer design
- Unique material for each layer
- AI-verified signal integrity
- Tailored PCB for peak performance
Key Features:
AI-optimized PCB layer and design material
Server-Grade Low Loss PCB*
Enhanced 2X Copper Technology
4X larger surface area for enhanced heat dissipation
- With up to 4 times the surface area of traditional coolers, this advanced design significantly boosts MOSFET cooling performance
True one-piece heatsink design
- Outperforms competitors' multi-piece solutions
- Integrated design and expanded surface area deliver exceptional cooling performance
Multi-cut design with channels for improved airflow
- More grooves, more airflow.
- Better airflow, cooler system.
SuperiorHeatpipe for optimal heat transfer
- Designed for optimal thermal conductivity
- Ensures efficient heat transfer and maintains system stability
5 W/mK thermal pad for efficient thermal conductivity
- High-performance thermal pad
- Keeps your system cool and running at peak efficiency
High Current Support
- Supports both PWM and DC fans, plus water cooling pumps
- Up to 24W (12V x 2A) capacity per fan header
- Built-in over-current protection
Precision Control
- Multiple temperature and fan speed points
- Customizable fan curves for optimal performance
Dual Curve Mode
- Choose between slope and stair modes
- Tailor cooling to your specific needs and preferences
Fan Stop Technology
- Fans can be completely turned off at low temperatures
- Ensures silent operation during light loads
Enhance Fan Curve UI
- 7 adjustable control points
- Expanded speed graph for precise adjustments
Slope/Stair Dual Graph Mode
- Slope mode: Smooth fan speed curve
- Stair mode: Steady speeds within temperature ranges
- Easy switching between modes
Manual Input
- Fine-tune fan speeds for optimal performance
- Precise control for enthusiasts
EZ Tuning
- Quick setup with 4 temperature and fan speed points
- Automatic optimization of fan curve
Fan Curve Profile
- Save personalized settings to BIOS ROM
- Maintain custom settings through BIOS updates
2.5GbE LAN
design deliver blisteringly fast transfer speeds to ensure the most stable transmission environment when the system is performing cloud computing or providing external computing services.
Enhancing VR Experiences with Wi-Fi 6E
Wi-Fi 6E enhances VR with faster speeds, lower latency, increased capacity, and stronger security, enabling seamless wireless streaming of high-quality VR games and improved multi-user experiences.
ower Latency
Lower latency ensures minimal delay between their actions and the corresponding response in online games, resulting in a more responsive and immersive gaming experience.
Higher Speeds
Faster transmission speeds enable quick downloads, seamless online gaming, and smooth video streaming without interruptions.
Increased Capacity
Wi-Fi 6E's increased capacity ensures smoother gameplay by minimizing congestion and maintaining consistent performance.
Broader spectrum
Wi-Fi 6E's use of the 6 GHz frequency band provides additional bandwidth, reducing congestion and interference from other devices.
Directional Ultra-high Gain Antenna
Boost your signal strength with GIGABYTE's Ultra-high gain Antenna, featuring smart antenna technology for optimized Wi-Fi signal transmission.
Specifications of GIGABYTE B850M Aorus Elite Wifi6E ICE DDR5 AMD Motherboard
| Model No | B850M-A-ELT-WF6E-ICE |
| CPU | AMD Socket AM5, support for: AMD Ryzen™ 9000 Series Processors/ AMD Ryzen™ 8000 Series Processors/ AMD Ryzen™ 7000 Series Processors (Go to GIGABYTE's website for the latest CPU support list.) |
| Chipset | AMD B850 |
| Memory | Support for DDR5 8200(O.C) / 8000(O.C) / 7950(O.C) / 7900(O.C) / 7800(O.C) / 7600(O.C.) / 7400(O.C.) / 7200(O.C.) / 7000(O.C.) / 6800(O.C.) / 6600(O.C.) / 6400(O.C) / 6200(O.C) / 6000(O.C) / 5800(O.C) / 5600(O.C) / 5200 / 4800 / 4400 MT/s memory modules. 4 x DDR5 DIMM sockets supporting up to 256 GB (64 GB single DIMM capacity) of system memory Dual channel memory architecture Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for AMD EXtended Profiles for Overclocking (AMD EXPO™) and Extreme Memory Profile (XMP) memory modules (The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to "Memory Support List" on GIGABYTE's website for more information.) |
| Onboard Graphics | Integrated Graphics Processor with AMD Radeon™ Graphics support: - 1 x DisplayPort, supporting a maximum resolution of 3840x2160@144 Hz * Support for DisplayPort 1.4 version and HDR. - 1 x Front HDMI port, supporting a maximum resolution of 1920x1080@30 Hz * Support for HDMI 1.4 version (Graphics specifications may vary depending on CPU support.)" |
| Audio | Realtek® Audio CODEC High Definition Audio 2/4/5.1/7.1-channel * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings. Support for S/PDIF Out |
| LAN | Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) |
| Wireless Communication module | Realtek® Wi-Fi 6E RTL8852CE - WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands - BLUETOOTH 5.3 - Support for 11ax 160MHz wireless standard (Actual data rate may vary depending on environment and equipment.) |
| Expansion Slots | 1 x PCI Express x16 slot (PCIEX16), integrated in the CPU: AMD Ryzen™ 9000/7000 Series Processors support PCIe 5.0 x16 mode AMD Ryzen™ 8000 Series-Phoenix 1 Processors support PCIe 4.0 x8 mode AMD Ryzen™ 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4 mode * The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot. Chipset: - 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x4 (PCIEX4) |
| Storage Interface | 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 25110/22110/2580/2280 SSDs: AMD Ryzen™ 9000/7000 Series Processors support PCIe 5.0 x4/x2 SSDs AMD Ryzen™ 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen™ 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4/x2 SSDs 1 x M.2 connector (M2B_CPU), integrated in the CPU, supporting Socket 3, M key, type 22110/2280 SSDs: AMD Ryzen™ 9000/7000 Series Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen™ 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen™ 8000 Series-Phoenix 2 Processors support PCIe 4.0 x2 SSDs 4 x SATA 6Gb/s connectors RAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices * RAID 5 is only available on AMD Ryzen™ 9000 Series Processors. RAID 0, RAID 1, and RAID 10 support for SATA storage devices |
| USB | CPU: - 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support - 2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel CPU+USB 2.0 Hub: - 4 x USB 2.0/1.1 ports on the back panel Chipset+USB 3.2 Gen 1 Hub: - 4 x USB 3.2 Gen 1 ports on the back panel Chipset: - 1 x USB Type-C® port with USB 3.2 Gen 2x2 support, available through the internal USB header - 3 x USB 3.2 Gen 1 ports (1 port on the back panel, 2 ports available through the internal USB header) - 4 x USB 2.0/1.1 ports available through the internal USB headers |
| Internal I/O Connectors | 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 1 x CPU fan/water cooling pump header 3 x system fan headers 1 x system fan/water cooling pump header 3 x addressable RGB Gen2 LED strip headers 1 x RGB LED strip header 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C® header, with USB 3.2 Gen 2x2 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/GC-TPM2.0 SPI V2 module only) 1 x HDMI port (Note) 1 x reset button 1 x reset jumper 1 x Clear CMOS jumper (Note) Actual support may vary by CPU. |
| Back Panel Connectors | 1 x DisplayPort (Note) 1 x Q-Flash Plus button 4 x USB 2.0/1.1 ports 5 x USB 3.2 Gen 1 ports 2 x USB 3.2 Gen 2 Type-A ports (red) 1 x USB Type-C® port, with USB 3.2 Gen 2 support 1 x RJ-45 port 2 x antenna connectors (2T2R) 2 x audio jacks 1 x optical S/PDIF Out connector (Note) Actual support may vary by CPU. |
| I/O Controller | iTE® I/O Controller Chip |
| H/W Monitoring | Voltage detection Temperature detection Fan speed detection Water cooling flow rate detection Fan fail warning Fan speed control |
| BIOS | 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 |
| Unique Features | Support for GIGABYTE Control Center (GCC) * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. Support for Q-Flash Support for Q-Flash Plus Support for Smart Backup |
| Operating System | Support for Windows 11 64-bit Support for Windows 10 64-bit |
| Form Factor | Micro ATX Form Factor; 24.4cm x 24.4cm |
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